Press-pack IGBT and diode modules
StakPak is a family of high power insulated gate bipolar transistor (IGBT) press-packs and diodes in an advanced modular housing that guarantees uniform chip pressure in multiple-device stacks.
Although the most common package for IGBTs is the isolated module, for applications requiring series connection, press-packs are preferred because of the ease with which they can be connected electrically and mechanically in series and because of their inherent ability to conduct in the shorted state – an essential feature where redundancy is required. Since IGBTs feature multiple parallel chips, there is a challenge - with conventional press-packs - in assuring uniform pressure on all chips. This problem was solved with a new patented spring technology.
The StakPak, optimized for series connection, features a modular concept based on submodules fitted in a fiberglass reinforced frame, which allows a flexible realisation of a range of products for different current ratings and IGBT/diode ratios.
For downloading and printing of data sheets in PDF format, click on the part numbers.
Part Number | VCES (V) | IC (A) | VCESAT (V) typ.125 °C | VF (V) typ.125 °C | IGBT-to-diode ratio | Housing | Plecs model | Offer |
---|---|---|---|---|---|---|---|---|
5SNA 1300K450300 | 4500 | 1300 | 3.4 | 2.4 | 1:1 | K | XML | Request |
5SNA 2000K450300 | 4500 | 2000 | 3.4 | 2.4 | 1:1 | K | XML | Request |
5SNA 2000K451300 | 4500 | 2000 | 3.65 | 3.0 | 2:1 | K | XML | Request |
5SNA 2000K452300 | 4500 | 2000 | 3.65 | 3.0 | 2:1 | K | XML | Request |
5SNA 3000K452300 | 4500 | 3000 | 3.65 | 3.0 | 2:1 | K | XML | Request |
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