R&D Technical Project Manager in Power Semiconductor Packaging 80 – 100% (f/m/d)

The opportunity
 

At Hitachi Energy Semiconductors, our R&D BiMOS department is dedicated to developing high-tech, faultless semiconductor devices and power modules. We manufacture these quality products at advanced internal and external production sites, delivering them to a diverse range of customers worldwide. Our applications span various industries, including renewable energy, traction, and E-mobility.
 

We are seeking a highly motivated and experienced R&D Technical Project Manager to join our R&D BiMOS Modules team. In this role, you will play a pivotal part in the development and packaging of power semiconductor devices. You will collaborate closely with design and process specialists to establish technology goals, features, and integration plans.
 

Are you interested in development work and passionate about working in a high-tech company to shape the future? Then apply today! Our flexible work practices help you optimize personal and business performance while creating an environment where all employees can develop their skills and grow.

How you’ll make an impact

• Lead the development activities of new Power Semiconductor Modules from concept to final product together with an interdisciplinary project team

• Oversee product development projects, ensuring they meet performance, cost, quality, and time-to-market requirements

• Manage resource planning, risk management, monitoring, and reporting for projects

• Define process requirements in line with the technology roadmap in close collaboration with the Process Engineering team

• Ensure BoM quality and supply in close collaboration with SCM and MQE teams

• Document development work, publish findings in journals and conferences, and contribute to inventions and patents related to power semiconductor modules

• Interface with key customers to identify and fulfil their semiconductor packaging technology needs
   

Your background 

• Master’s Degree or PhD in material science, mechanical or electrical engineering, physics, chemistry, or a related discipline

• Preferably, strong technical background in power semiconductor devices and packaging

• Strong technical background in power semiconductor devices and packaging

• Excellent leadership, communication, and documentation skills

• Ability to work collaboratively in a fast-paced, high-tech environment

• Strong problem-solving and analytical skills

• Proficiency in English is required; German is a plus